*Features

-The hold frame module can be added up to 4 molecules according to production volume requirements.

-The system supports molding of large substrate BGA, Low-K packages.

-The system is ideal for reducing wire sweep problems on package design that use fine-wire-pitch designs

  and long wires.

 

Specifications
Items	Unit	PMC 1040-S		PMC 1040-D
Dimensions	Module	1	2	3	4
	Width(mm)	3,140	3,780	4,420	5,060
	Depth(mm)	1,250
	Height(mm)	1,850
Sub Size	mm	130-260(L)X45-100(W)
Cycle(Machine) Time	sec	approx 35-45sec
Hold Frame Capacity	ton	40
Hold Frame Quantity	Module	1~ 4
Substrate Quantity	-	1~4		2~8
Molding Compound	-	Granular compound